The new generation of flexible reflow solder paste is now available a solder paste capable of adapting to various reflow temperature profile windows.
A solder paste that adapts to your needs; simply specify the alloy type you require, and let our solder paste deliver exceptional results for you.
The 11.5% flux content is ideal for producing thick fillets. The specialized flux in this solder paste withstands reflow temperatures to ensure incredibly smooth soldering results. It leaves behind a thin, clear transparent, and dry residue that does not crack, requiring no cleaning.
| FLEXI REFLOW SOLDER PASTE |
|---|
| EP-968FF 11.5% SAC305 T4 |
| EP-977HF 11.5% SAC305 T4 |
| EP-982FF 11.5% SAC105 T4 |
| EP-959FF 11.5% SAC0307 T4 |
- Very stable Solder Paste Viscosity
- For high end printing applications
- No slump
- Long tackiness
- Excellent wetability
- Possible to use it again while in stencil