Solderindo solder paste is a high-performance soldering solution designed for precision and reliability in SMT (Surface Mount Technology) applications. Formulated with high-quality alloy powders and advanced flux systems, it ensures excellent wettability, strong adhesion, and minimal residue. Solderindo solder paste provides consistent printing, stable viscosity, and superior solder joint strength, making it ideal for electronics manufacturing, PCB assembly, and fine-pitch component soldering.
| SOLDER PASTE | |||||
|---|---|---|---|---|---|
| Alloy Type | Category | Alloy Composition | Flux Type | Powder Type | Flux Content |
| SAC0307 | Lead Free | Sn R, Ag 0,3%, Cu 0,7% | EP-168FF, WS-337 | Type 4 | 12% |
| SAC305 | Sn R, Ag 3%, Cu 0,5% | Type 4 | 12% | ||
| SnBiAg | Sn 42%, Bi 57%, Ag 1% | EP-105FF | Type 4 | 10% | |
| SnPb63 | Leaded | Sn 63%, Pb 37% | EP-123FF, WS-337 | Type 3 | 10% |
| SnPb622 | Sn R, Ag 2%, Pb 36% | Type 3 | 10% | ||
Available in various packaging options: 30-gram and 500-gram pots, 50-gram syringes, and 1 kg syringe packages.
Request the MSDS for more details.